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Comment 1

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I'm worried about this page and a few others (one that I revised already) that 216.237.32.xxx has entered in today. They are suspiciously too good and comprehensive. I'm sure they are copied from somewhere, but I couldn't find them with a search engine. -- ansible 08:34, 16 October 2001 (UTC)[reply]

I'm -very- flattered. However, it's just me. Ray Van De Walker,

and I have assented to GPL my writing in the Wikipedia. If you really like it, add it to the "good writing" link! (Something which I think would be unethical for me to do as author.) 15:51, 25 February 2002 (UTC)

Concerns regarding clarity and sourcing in Power Efficiency section

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The paragraph beginning with "Modern circuits require more power overall..." has several issues:

  1. While underlying concepts are correct, this paragraph needs authoritative sources such as: ITRS/IRDS roadmap documents on power scaling challenges, primary literature on Dennard scaling breakdown, IEEE publications on power delivery networks and thermal management (ISSCC, ISCA proceedings), semiconductor manufacturer technical documentation.
  2. The statement "heat ... increases resistence" conflates cause and effect. Temperature-dependent resistance in interconnects (particularly copper/aluminium) creates feedback mechanism that should be explained more clearly.

Redshiftgtk (talk) 17:42, 6 January 2026 (UTC)[reply]

I have added initial citations from the IRDS 2022 roadmap and related semiconductor scaling literature to address the needed citations in the power efficiency section. I recognize these could be supplemented with additional authoritative sources. If anyone has access to more specific primary sources, please feel free to add them. Redshiftgtk (talk) 02:42, 7 January 2026 (UTC)[reply]